VTEP/TestJet Testing

Before beginning test development, determine if a VTEP¹ test is appropriate for each device (see Table 6). Consider the following:

There must be metallic surfaces (pins, leads, or leadframes in the device) to which the VTEP probe can couple.

iVTEP enhances VTEP’s ablility to make reliable measurements where metallic surfaces (pins, leads, or leadframes in the device) to which the VTEP probe can couple are minimized. You should consider adding a VTEP test for all ICs.

Signal, sense, and digital probes for through-hole devices need to be placed at locations other than on the device; otherwise, you can test only for bent pins that are not inserted in the PC board.

Due to physical characteristics, some devices might require special fixturing.

Standard and small VTEP probes can be used on either side of the fixture, top or bottom; VTEP connector probes can be used only on the top side.

Also consider the VTEP/TestJet fixturing requirements.

To use VTEP to test devices on the board, there are four approaches to consider. They are:

VTEP Test Only — Test appropriate devices with VTEP to verify only the presence and connectivity of the device.

VTEP Test with Disable Information — Test devices with VTEP and include setup-only library tests with disable information for devices that need to be disabled for powered tests of downstream devices.

VTEP Test and Powered Test — Test devices with VTEP and include library tests for powered testing. To release the test and fixture to production as soon as possible you can test devices with VTEP only, but include setup-only tests and add powered testing later.


		If you plan to add VTEP probes to your fixture in the future, specify them as you develop the board test so that space and resources are provided in the fixture. Adding VTEP probes later without the necessary space and resources may be very difficult or even impossible.

VTEP Test and NPM Test — Test connectors with additional coverage for power, ground and fixed pin coverage. You do this by specifying a connector model from Table 5.

To request for a library file for a new connector not currently in your ICT software, go to www.agilent.com/see/npm and click the link under New NPM Connector Library File Request.

Table 5 Connector models
Description	Typical Manufacturer Part Numbers	Connector Model Name
Fully Buffered DIMM (FBD), 240 pins DDR II	AT54007-H3BF-4F	fbd_ddr2_240_pin
DIMM, 240 pins DDR II	1775805-1	ddr2_240_pin
PCI Express 32X	2EG0E017-D2D-DF	pci_express_32x
PCI Express 16X	2EG38211-D2D-4F	pci_express_16x
PCI Express 8X	2EG08211-D2D-DF	pci_express_8x
PCI Express 4X	2EG03211-D2D-DF	pci_express_4x
PCI Express 1X	22EG01811-D2D-DF	pci_express_1x
Serial ATA 22 pins	LD11223-S03	sata_22_pin
Metral® 11Row	2H251103-NC201	metral_11_row
FH B-T-B 0.8mm, 80 pins	177983	08mmfh_80
775 pin LGA CPU socket*	PE077507-2041-01	lga_775
1207 pin LGA CPU socket*	PE120703-3741	lga_1207
* Available from release 07.10p of the Medalist i3070 software.

¹ Information on VTEP also applies to TestJet, unless otherwise specified.

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