Decide what test strategy to use on your PC board. When determining the test strategy, consider the items listed in Table 3. It is not an exhaustive list but is intended to show the kinds of factors to consider.
Possible test strategies include:
(Refer to Analog Testing and Digital Testing for information about the test methodologies involved.)
Also consider the additional test strategies and methodologies in Table 4.
To define and document the test strategy:
1 Learn the function of the board and its components.2 Identify the clusters to be functionally tested (digital testing only).It is better to have several small clusters than a few large ones. Smaller circuits let the development software make more efficient use of testhead resources and require fewer module cards to implement the test. Also, diagnosing faults within small clusters is easier than diagnosing faults within large clusters.3 Determine device dependencies.Arrange the testing according to device dependencies. For example, if device A will not work unless device B is working, device B needs to be tested first.4 Determine digital device intrinsics.Determine digital device intrinsics, for example, determine the internal resistance between two pins of the device. Model the device in the board description with an internal device entry or a Part Description Library.5 Determine which fault types to cover.Decide which fault types your test will identify. For example, do you need to diagnose which RAM cell is faulty or is it enough to know that the RAM chip is not working? If your board has a device that can operate at a higher speed than the circuit requires, is it necessary to test that device to its high-speed specification?6 Determine fixture strategy.Possible fixture strategies are:Also consider:7 Document the strategy.
Table 4 Optional test strategies and methodologies
Option Description Develop and maintain one test and fixture for multiple versions of a PC board. Develop board tests and fixtures for multiple-board panels. Test up to four boards of a single-board-type panel simultaneously. Develop a dual-well fixture that has parallel wiring (helps to eliminate handling time on high-volume lines). (Mux systems only)
An unpowered test of the connectivity of device pins. An unpowered test of the orientation (polarity) of electrolytic capacitors. Use VTEP technology to test devices through series components, such as resistors, capacitors, and inductors. (Mux systems only)
Test passive analog components that cannot be tested in-circuit due to insufficient electrical access to nodes. Vectorless Test EP (VTEP) and TestJet1 An unpowered test which targets manufacturing defects such as connectivity problems (e.g. lifted pins, non-wet pins) and missing devices. Extension of VTEP capability targetting at pins of integrated circuits which are too low for VTEP measurement. Extension of VTEP capability targetting at power and ground pins of connectors and sockets. Perform Cover-Extend tests on connectors and sockets. Advanced Boundary Scan Develop tests for digital devices that comply with IEEE Standard 1149.1 and 1149.6. Silicon Nails Perform Silicon Nails tests on non-Boundary-Scan devices. Device Programming Use flash and PLD programming.
Note the Additional Considerations for Optional Test Methodologies if these test strategies and methodologies are to be implemented.
8.10 Some of the most frequently used BT-BASIC commands used are: msi Changes default working directory. Mass storage is Same as “msi” cat Catalogs (list)the node names in the specified directory. get Brings the contents of a file into the system workspace. ...
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